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GlobalFoundries signs $2B TSMC deal for US silicon interposers
VERIFIEDTech· 

GlobalFoundries signs $2B TSMC deal for US silicon interposers

GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.

via DigiTimes Asia· Curated by Xavier RiveraRead story
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