The Circuitry
THE CIRCUITRYYour one-stop source for all tech news
HOMETODAYNEWSFEEDEVENTS
BOOKMARKS
RSS
© 2026 The Circuitry
About UsSourcesContactCorrectionsPrivacy
  • Today
  • Feed
  • Events
  • Saved
Scroll for more
Verification
VERIFIEDConfidence: HIGH
Source identified
Claims cross-referenced
No discrepancies found
Fact-check summary

Reuters, Nvidia's newsroom, BNN Bloomberg and Taiwanese outlets confirm Nvidia took $3.5B of MediaTek's $3.9B convertible bond priced August 31.

Sourcing
1source

via DigiTimes Asia

DigiTimes Asia · track record
50Stories
100%Verified
830d
All sources →
Markets
NVDA···

Live quote · not investment advice

From The CircuitryWhy The Circuitry

Verified tech news, cross-checked.

Every story is checked against independent sources before it posts — no rumors dressed up as fact.

How we verify →
Home/Markets/Nvidia subscribes to US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
VERIFIEDBy Xavier Rivera· ·1 min read

Nvidia subscribes to US$3.5 billion of MediaTek's record US$3.9 billion convertible bond

MediaTek finalized pricing of a record US$3.9 billion overseas convertible bond on August 31, 2026, with Nvidia reportedly subscribing to US$3.5 billion or roughly 90 percent of the total. The issuance, which exceeds NT$120 billion, is described by the company as the largest overseas CB ever from a Taiwanese issuer.

Source:DigiTimes Asia
Post
Nvidia subscribes to US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
From The CircuitryWhy The Circuitry

Verified tech news, cross-checked.

Every story is checked against independent sources before it posts — no rumors dressed up as fact.

How we verify →
TL;DRAI · 60 sec read

Nvidia subscribes to US$3.5 billion worth of MediaTek's record US$3.9 billion convertible bond. This represents roughly 90 percent of the total issuance priced by the Taiwanese firm. The transaction sets a new record for overseas convertible bonds in Taiwan and shows the deepening partnership between the two semiconductor companies on joint projects.

MediaTek has finalized the pricing of its largest-ever overseas convertible bond, a US$3.9 billion package worth more than NT$120 billion that the company reportedly calls the biggest such issuance in Taiwan's capital market. Nvidia reportedly took US$3.5 billion of the offering, or roughly 90 percent of the total.
The convertible bond structure gives Nvidia potential equity upside in MediaTek while providing the Taiwanese chip designer with fresh capital.
MediaTek sets a new record for overseas convertible bonds in Taiwan. The fabless chip designer priced the US$3.9 billion deal on August 31, 2026. It exceeds NT$120 billion and surpasses any previous overseas CB from a Taiwanese issuer according to MediaTek.
POST FROM @MediaTek· Official MediaTek announcement tweet on the US$3.9B convertible bond with NVIDIA participation
https://x.com/MediaTek/status/2094433280552562873
Nvidia commits the vast majority of the issuance. The graphics giant took US$3.5 billion, accounting for roughly 90 percent of the bonds. The subscription leaves only a small portion for other investors.
From The CircuitryThe Feed — live briefs across tech, all day.See what’s happening →
The deal reflects deepening ties between the two semiconductor firms. MediaTek and Nvidia have collaborated on multiple silicon projects in recent years. The convertible bond structure gives Nvidia potential equity upside in MediaTek while providing the Taiwanese chip designer with fresh capital.
MediaTek and Nvidia have collaborated on multiple silicon projects in recent years.
From The CircuitryWhy The Circuitry

Verified tech news, cross-checked.

Every story is checked against independent sources before it posts — no rumors dressed up as fact.

How we verify →
The transaction closed its pricing on the same day it was announced. MediaTek described the size as a milestone for Taiwan's capital markets. No further terms such as conversion price or maturity date were disclosed in the announcement. The two companies have previously worked together on AI-related chip designs.
Why this mattersAI · ~100 words

Tap a lens to see what this story means for you.

Morning Brief

Liked this? The Brief brings you the whole day in tech, verified, every morning.

Two minutes, free forever. What's in The Brief →

Reader-supported
DonateBuy me a coffee →Follow@thecircuitry_ →Follow@thecircuitry.to →
HELP US IMPROVE
From The Circuitry

See what’s happening right now

The Feed runs all day — short, verified briefs the moment they break.

Open the Feed →
From The Circuitry

Follow @thecircuitry_

Every story we publish, as it happens. No noise between.

Follow on X ↗On Bluesky ↗

Reader-supported

The Circuitry is a passion project I've always wanted to build, and I love the work behind it.

Running it costs real money. APIs, hosting, time. To keep improving the site and growing this into something useful for everyone, those costs have to be covered.

Any contribution is appreciated. If not, no pressure. Thanks for reading.

Buy me a coffee
MediaTekNvidiaConvertible BondsSemiconductors
More fromDigiTimes Asia
  • GlobalFoundries signs $2B TSMC deal for US silicon interposers

    Tech · 8h
  • Marvell lifts 2028 revenue target to approximately $20B on AI connectivity

    Tech · 2d
  • Report: Biren Technology Prepares BR20X GPU for Mass Production

    Tech · 6d
More inMarkets
  • Standard Chartered to Offer Digital Asset Custody in Singapore

    Markets · 18h
  • OKX Secures Backing at $25 Billion Pre-Money Valuation

    Markets · 1d
  • Skydance merger closes, Musk regains trillionaire status, AI risks flagged

    Markets · 2d
SupportThe Work

The Circuitry is reader-supported. If you find the daily brief useful, you can buy me a coffee to keep it going.

Buy a coffee →
From The CircuitryWhy The Circuitry

Verified tech news, cross-checked.

Every story is checked against independent sources before it posts — no rumors dressed up as fact.

How we verify →

MORE IN THIS BEAT

All Markets →
  • Tech· 

    GlobalFoundries signs $2B TSMC deal for US silicon interposers

    GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.

  • Tech· 

    First Nvidia RTX Spark laptops range from $2,599 to nearly $7,000

    The first laptops built on Nvidia's RTX Spark chip, from Microsoft, Asus, Dell, HP, Lenovo and MSI, start at $2,599 and climb to $6,999.99 for a maxed-out Asus ProArt P16 with 128GB of unified memory, The Verge reports. The first models ship as early as October 16.

  • Tech· 

    Microsoft opens Surface Laptop Ultra preorders and pushes AI agents deeper into Windows

    At its Windows and Surface event, Microsoft opened preorders for the $2,599 Surface Laptop Ultra and the $5,999 Surface RTX Spark Dev Box, and said Copilot will be able to use files and act across Windows in the coming months.

  • Tech· 

    SpaceX seeks $40B debt led by Apollo to buy Nvidia chips

    SpaceX is seeking $40 billion in debt financing led by Apollo Global Management to buy Nvidia AI chips, with talks still early and a possible 2027 close. The move highlights the scale of capital required for AI infrastructure expansion across Musk's companies.

  • Tech· 

    Marvell lifts 2028 revenue target to approximately $20B on AI connectivity

    Marvell Technology raised its fiscal 2028 revenue outlook to approximately $20 billion and set a fiscal 2031 target of $70-90 billion. The increases reflect expected growth in AI networking and optical connectivity demand.