GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
The Malta facility will serve as the first US-based source.
https://x.com/GlobalFoundries/status/2108187157252718870
This marks the initial domestic capacity for this component in the United States.
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