Patent filings analyzed by SemiAnalysis show ASML developing a die-to-wafer hybrid bonder for advanced packaging. The move positions the lithography leader against Besi and other suppliers as chipmakers seek growth beyond transistor scaling.
Advanced packaging draws equipment makers as transistor scaling grows costlier.
ASML would compete with Besi and other front-end suppliers.
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GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
ASML confirmed on July 15 that Intel Foundry shipped the first high-volume logic product made with High-NA EUV lithography for Panther Lake. The milestone advances commercial readiness of the technology while ASML prepares TSMC and Samsung for wider adoption.
Intel shares fell 14% in after-hours trading on Oct. 29, per Reuters, with later reports putting the drop at about 17% to more than 20%, after the company guided fourth-quarter revenue below estimates. CFO David Zinsner told Reuters an October explosion at its Kiryat Gat, Israel fab will cut about $600 million of revenue over two quarters.
AUO's board approved selling its Taichung Plant Phase II buildings, cleanrooms and facility equipment in Xitun District to TSMC for NT$38.8 billion (about US$1.2 billion) before tax, per AUO's TWSE material-information filing as reported by TechNews and DigiTimes. AUO expects a disposal gain of about NT$18.5 billion, with payment in installments under the property contract. Separately, AUO ended a planned NT$19.7 billion sale of its Huaya site to Quanta because the two sides could not agree on specs and delivery timing.
DigiTimes: ByteDance is in advanced talks with MediaTek to buy custom data center chips, and an agreement could come soon, according to people familiar with the matter. Bloomberg first reported the talks, saying a deal would help MediaTek compete with Qualcomm and Broadcom in data centers.
