DigiTimes: ByteDance is in advanced talks with MediaTek to buy custom data center chips, and an agreement could come soon, according to people familiar with the matter. Bloomberg first reported the talks, saying a deal would help MediaTek compete with Qualcomm and Broadcom in data centers.
Correction (Oct 15): An earlier version said both companies would gain more flexibility in their component sourcing and described a Bloomberg image credit as part of the reporting. Neither claim was in the reporting; the story now sticks to what DigiTimes and Bloomberg reported.
ByteDance aims to lock in reliable sources for its semiconductor needs via this potential arrangement.
MediaTek stands to strengthen its foothold within the data center segment.
According to DigiTimes.
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Intel shares fell 14% in after-hours trading on Oct. 29, per Reuters, with later reports putting the drop at about 17% to more than 20%, after the company guided fourth-quarter revenue below estimates. CFO David Zinsner told Reuters an October explosion at its Kiryat Gat, Israel fab will cut about $600 million of revenue over two quarters.
AUO's board approved selling its Taichung Plant Phase II buildings, cleanrooms and facility equipment in Xitun District to TSMC for NT$38.8 billion (about US$1.2 billion) before tax, per AUO's TWSE material-information filing as reported by TechNews and DigiTimes. AUO expects a disposal gain of about NT$18.5 billion, with payment in installments under the property contract. Separately, AUO ended a planned NT$19.7 billion sale of its Huaya site to Quanta because the two sides could not agree on specs and delivery timing.
Patent filings analyzed by SemiAnalysis show ASML developing a die-to-wafer hybrid bonder for advanced packaging. The move positions the lithography leader against Besi and other suppliers as chipmakers seek growth beyond transistor scaling.
GlobalFoundries will operate up to two new chip fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion, with Japan supplying the money. The first fab, about $10 billion, is due online in 2029; a second, about $10 billion more, is still subject to approval.
GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
